A key feature of the QuickLok is the ability to vacuum transfer specimens that are sensitive to normal environmental conditions. The transfer device includes a sealed vacuum chamber which can be interfaced to a glove box for inert gas transfer or vacuum transfer from a wide range of instruments.
RF plasma allows the low-temperature modification of a wide range of specimens and substrates. Plasma etching is generally confined to the semiconductor industry, where the Quorum K1050X can be used to remove silicon layers using reactive gases, such as CF4 and for the removal of photoresist using oxygen.
The K1050X is a modern, solid-state RF plasma barrel reactor designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, plasma ashing and plasma cleaning applications.
The E4800 Series of Recirculating Heaters/Chillers are recommended for a wide range of open and closed-loop temperature control applications. The E4860 is an option for the E3100 and K850MW critical point dryers. For applications requiring heating only, the E3500 Thermocirculator is recommended.