Electron and ion beam focal points coincidation
AMBER X FIB-SEM from TESCAN is a unique combination of Plasma FIB and field-free UHR FE-SEM for the widest range of multiscale materials characterization for samples that have proven challenging for typical Ga FIB and FE-SEM instruments. AMBER X pairs a Xe plasma FIB with BrightBeam™ SEM optics to provide high throughput, large area ion milling and field-free ultra-high resolution imaging for 2D and 3D multi-modal characterization on the widest range of conventional and novel materials
AMBER FIB-SEM from TESCAN is a versatile nanoanalytical FIB-SEM system to expand your materials research capabilities that comes with attractive optional packages for various applications. AMBER gives Array of micro-compression pillars, A cross section through a defect in a multi-layered coating and a Wide Field mode for large sample imaging and navigation.
SOLARIS FIB-SEM from TESCAN is an Advanced nanofabrication workbench for your research lab with easy-to-use modular software user interface. Solaris is capable to extract Nanofabrication of a 3D optical vortex structure using Python script, In-situ tensile test experiment of a single-layer graphene flake and is is ideal for FIB-SEM nanotomography of SERS substrate.
AMBER CRYO FIB-SEM system is an An alternative solution to prepare cryo lamellae for your TEM that has a flexible cryo-FIB-SEM workstation for your most demanding applications under cryogenic conditions. It comes with an attractive optional packages for various applications.
SOLARIS FIB-SEM from TESCAN is an advanced UHR FIB-SEM for 2D and 3D characterization of your biological and beam-sensitive samples and is perfect for Cryo UHR SEM imaging and cryo-FIB-SEM applications. SOLARIS can show Resin embedded mammalian cells. Additionally inverted image was acquired, Resin embedded brain tissue. Cross-section was prepared with Ga FIB and visualized using In-Beam BSE detector and 3D ultrastructural reconstruction of mammalian cell.
SOLARIS X from TESCAN is a Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis and is Complemented with stand-alone laser ablation which frees the Plasma FIB for final targeted material removal, sample thinning or cross-section polishing. SOLARIS X has a variety of effective techniques and recipes of SOLARIS X for fast and artefact-free cross-sectioning of composite samples at high currents