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Tescan SOLARIS X for Semiconductors

SOLARIS X from TESCAN is a Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis. It pairs the high-throughput i-FIB+™ Xe plasma FIB column with the Triglav™ UHR electron column to extend the capabilities of FIB physical failure analysis to include large-area and deep cross-sectioning on advanced packaging, microelectro-mechanical devices and optoelectronics. Powerful TESCAN Essence™ software allows users to customize the GUI for specific application workflows and to accommodate user expertise or preferences. TESCAN SOLARIS X is easy to implement in quality assurance labs and R&D labs that assess semiconductor packaging quality.


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