Tescan FIB-SEM systems for semiconductor applications provide a precise and versatile platform for cross-sectioning, imaging, and analysis of nanoscale devices. By integrating high-resolution SEM imaging with accurate focused ion beam milling, these systems enable detailed inspection of multilayer structures, interconnects, and critical device features. Fast and controlled material removal, combined with advanced detector integration, ensures consistent, reproducible results for failure analysis, process development, and device characterization.
<...